Interview with Imaging & Machine Vision Europe

Our Senior Product Manager, Dr. Samiul Haque, was recently interviewed by Imaging and Machine Vision Europe about quantum dot technology and our SWIR products.

Here is the link for the full interview, article courtesy of IMVE: Inside Emberion: using quantum dots to transform infrared imaging

Q/A session (snap shot of the interview):

Senior Product Manager at Emberion, Dr. Samiul Haque, sits down with Imaging & Machine Vision Europe to discuss how the company’s quantum dot sensors enhance infrared cameras, opening doors to new markets and applications.

Imaging & Machine Vision Europe: Tell me about Emberion. What’s your process for driving innovation in advanced infrared camera and sensor development?

Samiul Haque: Emberion spun off from Nokia technologies in 2016 and is an independent company based in Espoo, Finland and Cambridge, UK, with a background in cutting-edge research and developing sensors and sensor technologies.

As a company, we design our own CMOS read-out integrated circuits (chip design) at the Espoo HQ, while the Cambridge office has expertise in quantum dot nanotechnology-based devices. Both of these design and manufacturing centres work as one team to integrate quantum dots with the custom-designed chip.

This allows the company to own its own IP, having the freedom to operate with unique design features and operate in various markets using diversified products. Emberion is one of few companies with an end-to-end design process, from the chip all the way to camera products including electronics, material deposition and hardware/software (HW/SW) integration.

The team thrives on innovation, believing in the development cycle with a unique design-based mindset. Our innovation pipeline drives our current and future roadmaps, which we continuously improve to create optimised solutions.

Collaborating closely, our product management and R&D teams deliver market- and customer-driven products. One of the company’s visions, for example, is to design a tri-band image sensor chip that can simultaneously operate in the Vis / SWIR / Thermal, enabling the user to work in all infrared bands, with one single camera.