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Game Changing Products through Unique Technologies

Emberion provides game-changing products for professional imaging and photodetection based on our unique skills in integrating graphene transducers, nanostructured optical absorbers and in-house designed CMOS circuitry. Our team has created more than 300 patent applications in related technologies and our steadily growing IP portfolio ensures that we have a full freedom to operate. Our groundbreaking work has been reported in numerous publications in high-impact scientific journals.


Nanomaterials and Radiation Absorbers

Emberion’s know-how integrating optically-absorbing materials with graphene transducers provides a versatile way of creating sensors and detectors on CMOS ROIC substrates for diverse applications.

Emberion has developed sensor device structures and manufacturing methods combining nanocrystalline optical absorbers with graphene-based transistors, enabling photodetection from visible (VIS, 400 nm) to SWIR (1800 nm) wavelengths. Our semiconducting nanocrystalline material enables convenient fabrication directly on standard CMOS wafers. This is a major advantage compared to the hybrid packaging processes required for competing semiconductor heterosubstrate-based transducers, such as InGaAs-photodiodes, which suffer from decreased yield, reliability and higher manufacturing cost. Emberion employs different colloidal quantum dot materials that can be integrated reliably on graphene transducers and can be tailored to meet specific wavelength range and response curve requirements.

Emberion is also developing MEMS devices in which a suspended pyroelectric substrate structure absorbs thermal radiation and acts as a modulator for the graphene-transistor. These microbolometer devices are sensitive to MWIR and LWIR thermal radiation and can be tuned to be selective to specific spectral ranges by modifying antenna structures on the pyroelectric film.



Graphene – 2D Layered Materials

Emberion’s technology is based on highly-sensitive graphene transducers, which detect the electric charge generated in surrounding materials and convert the original optical signal into an electrical signal via a high-gain amplification mechanism. Graphene transducers provide significant benefits for photodetector and sensor products since they are uniquely able to be fabricated directly on CMOS wafers i.e. using one material platform technology. The key benefit is the ability to monolithically fabricate different graphene-based wavelength-specific detectors on custom designed ROICs through low-temperature post-processing.

Custom ROIC Design (CMOS)


Emberion designs its own custom read-out integrated circuits (ROICs) for VIS-SWIR and thermal detector arrays to ensure best compatibility with graphene and to allow us to maximally exploit its superlative properties. This approach provides definite advantages, allowing us to create bespoke modular solutions for customer requirements. The ROICs are designed for our particular sensor device structures, ensuring optimal detector performance and sensor signal quality. Our in-house IC design capability enables us to cater for customer requirements regarding pixel geometry and architecture in a truly flexible manner. These tailored ROICs are manufactured with conventional CMOS processes available at commercial foundries. We incorporate layers of nanomaterials and graphene monolithically on top of the ROIC wafers leading to a cost-efficient manufacturing process scalable to high production volumes.

System Integration

System Integration

Our sensor products are designed for easy integration with customers’ systems. The integrated ROIC implements multiple functionalities, including array multiplexing, analog-to-digital conversion, a global electric shutter, High Dynamic Range imaging, adjustable amplification levels, and noise reduction and other signal quality enhancements via Correlated Double Sampling. The sensor components are validated to meet the industrial reliability standards (JEDEC). In addition, Emberion offers measurement modules which can be utilized for sensor technology evaluation purposes or as reference implementations for product integration. These module boards provide calibrated digital image data output and perform rudimentary low-level image processing steps.

Future Research

Future Research Topics

Emberion’s technologies are based on materials that can be deposited on diverse substrates, including flexible ones. Functional photodetector arrays can be produced on flexible polymer substrates or on rigid glass substrates. The combination of very high performance, cost-efficient manufacturing, and deposition on potentially flexible, large area substrates is unique proposition creating new applications and business opportunities for our customers.

Multispectral Detectors: Based on similar graphene transducers, it is possible to combine our VIS-SWIR photodetectors and thermal detectors at the pixel level on a single die creating a multispectral detector array. In this way we are able to cover broad spectral ranges with a single imaging sensor, offering a compact high-performance broadband imaging solution.

X ray: The excellent responsivity and noise performance of our graphene-sensors lead to high-fidelity image quality with smaller X-ray dosages and to competitive manufacturing costs compared to existing sensor technologies. The large dynamic range of the sensor ensures the capture of detailed images even in the case of extreme intensity level variations within a single exposure. Novel detector device form factors, e.g. curved panels, can be achieved by building sensor arrays on a flexible substrate.

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Here you can find publications published by Emberion team members. If you need further information on our technologies or specific publications, please send an e-mail

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